Finishing compound semiconductor crystals to a mirror-like precision through mechanochemical processing!
"INSEC" is a polishing material that precisely finishes compound semiconductor crystals to a mirror surface through mechanochemical processing. It comes in a variety of types, including "FP (primary polishing material)" and "NIB (final polishing material)" for GaAs wafers, as well as "P (final polishing material)" for GaP wafers. Additionally, we offer "SP," a polishing material specifically for precision polishing of GaAs wafers, and "IPP (primary polishing material)" for InP wafers. It is also effective as an etching material for GaAs and GaP LED-related applications. All of these materials are in granular form and are dissolved just before use. 【Features】 ■ Polishing material that finishes to a mirror surface with high precision ■ Wide variety of types ■ Effective as an etching material for GaAs and GaP LED-related applications *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Recommended Dissolution Ratio】 ■INSEC FP ・〈INSEC FP〉46g : Pure Water 1,000 cc ■INSEC NIB ・〈INSEC NIB〉36g : Pure Water 1,000 cc ■INSEC SP ・〈INSEC SP Granules〉6g : Colloidal Silica 1,000 cc : Pure Water 3,000 cc ■INSEC IPP ・〈INSEC IPP Granules〉80g : Colloidal Silica 500 cc : Pure Water 4,500 cc *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.
![[Research Material] The Global Market for Zinc Oxide in Rubber](https://image.mono.ipros.com/public/product/image/19a/2000842404/IPROS88077804997449974099.jpeg?w=280&h=280)
