Achieving high-speed high-pressure grinding of PCD! High-speed high-pressure grinding processing.
The substrates such as SiC (silicon carbide), GaN (gallium nitride), and PCD (sintered diamond), which are expected to expand in the market in the future, are difficult materials to process due to their hard and brittle nature. Among them, we would like to introduce a case study that achieved the polishing of sintered diamond, which is particularly challenging to process. [Polishing Results] ■ Surface roughness < 3nm ■ Processing time 4 hours (processing time with conventional methods 10 hours) ■ By using the high-speed high-pressure polishing machine 'EJW-400HSP' and the fixed grinding stone 'MAD Plate', we achieved a reduction in processing time by 6 hours. *For more details, please refer to the PDF document or feel free to contact us.
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【Device Specifications】 ■Material/Dimensions: Sintered Diamond (PCD) / Outer Diameter 65mm ■Applications: Cutting tools, wear-resistant components, anvil scribers, etc. ■Required Precision: Surface roughness <5nm, reduction of processing time (currently 10 hours) ■Device Model: EJW-400HSP ■Device Specifications: High-speed and high-pressure lapping specifications ■Polishing Method: Fixed grinding stone MAD Plate, processing heat temperature control *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company is committed to providing cutting-edge lap technology based on the know-how of diamond wrapping that our sister companies in the United States and various European countries have accumulated over many years. All of our staff sincerely look forward to serving customers who seek higher precision and quality in wrapping process technology.
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