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  6. Uniform and high-density continuous plating is possible on φ0.005mm ultra-fine wire over its entire length.

Uniform and high-density continuous plating is possible on φ0.005mm ultra-fine wire over its entire length.

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last updated:Mar 02, 2022

トクサイ 本社
トクサイ 本社
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Continuous plating of ultra-fine wire with a very thin and long unique technology from Tokusai.

A major feature of continuous wire plating is that it maintains a uniform color throughout its entire length, with a plating thickness that is consistent (±0.2μm) and excellent adhesion properties. Additionally, it is possible to apply multiple platings (such as gold, nickel, and copper) on a single wire. Furthermore, thanks to Tokusai's superior wire drawing technology, post-plating wire drawing processing is also possible, resulting in a smooth surface finish! For ultra-fine wire plating, we have a production record of over 20,000 meters (20 km) per wire. Tokusai has been continuously challenging itself for 70 years since its founding, looking towards an endless future. Would you like to utilize our extremely fine plating wire of φ0.005mm, which can only be achieved by Tokusai, to create a new world with your technology? 【Main Materials】 ■ Tungsten ■ Molybdenum ■ Copper Alloy ■ Iron-Nickel Alloy ■ Brass Wire ■ Piano Wire ■ Stainless Steel *For more details, please refer to the PDF materials or feel free to contact us.

    Processing ContractPlating EquipmentSurface treatment contract service
Plating_300x300px.jpg

Uniform and high-density continuous plating is possible on φ0.005mm ultra-fine wire over its entire length.

Plating_300x300px.jpg
Plating_300x300px.jpg
  • Related Link - http://www.tokusai.co.jp/%E3%82%81%E3%81%A3%E3%81%…

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【Possible Plating Types】 ■ Gold, Silver, Copper, Nickel, Palladium, Tin-Copper 【Wire Diameter and Plating Thickness】 ■ Compatible Wire Diameter (mm) ・φ0.005 to 0.500 ■ Plating Thickness (μm) per side ・0.1 to 20 *For more details, please refer to the PDF document or feel free to contact us.

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Technical Data: Wire Drawing and Plating Process

Technical Data: Wire Drawing and Plating Process

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トクサイ

トクサイ 本社

Electronic Components and Semiconductors

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Tokushai Co., Ltd. manufactures and sells various metal and alloy wire drawing processes and drawn products (such as cut pins, rods, straightening processes, and flat wire produced by rolling), starting with difficult-to-process materials like tungsten and molybdenum, as well as stainless steel, nickel-titanium alloys, and beryllium copper alloys. Additionally, thanks to our unique plating production line, we can also produce continuously long plated wires. With 70 years of experience in wire drawing (drawing and pulling) technology and the craftsmanship of skilled artisans who create wires so thin they are nearly invisible, we realize a world of ultra-fine wires. Starting with tungsten wire for Christmas light filaments as our founding product, Tokushai has expanded its business alongside the development of the lighting market, including incandescent bulbs, fluorescent lamps, and automotive bulbs. Today, we have broadened our market to include semiconductor testing equipment (probe cards), electronic components, medical devices, and even the aerospace industry, responding to various customer needs.

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