It becomes possible to have highly reproducible printing settings that do not rely on experience or intuition.
Tenryu Seiki will begin selling a set of the newly developed solder behavior analysis device "Rheology Analyzer" and the cream solder printer "TSP-800." The "Rheology Analyzer" is a device that can measure the resistance of cream solder against a surface. The "TSP-800" is a cream solder printer that can be linked with the Rheology Analyzer (solder behavior analysis device) and allows for digital setting of printing conditions. By sending analysis data from the two products via network, it enables highly reproducible printing settings that do not rely on experience or intuition. 【Features of the Rheology Analyzer】 ■ Simulates the flow of solder through actual mask openings ■ Confirms the separation phenomenon of solder and flux ■ Capable of measuring fine powder (Type VI) ■ Easy operation and measurement ■ Measurement time of about 5 minutes per test, with a usage amount of 20cc *For more details, please feel free to contact us.
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**TSP-800 Features** - Full digital printing condition settings possible through data input from the rheology analyzer - Ensures consistent quality through shared printing conditions - Improved print quality through data integration with SPI - Quality and tact improved with a squeegee unit controlled by motors and pneumatic pressure - Enhanced substrate clamping performance by edge clamping the entire substrate outline - Achieves high filling performance by using a TH squeegee - Easy exchange between M size and L size as no mask adapter is required *For more details, please feel free to contact us.*
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Since our establishment, we have consistently focused on "automation technology," accumulating advanced technical skills in the development and manufacturing of industrial automation equipment. The various FA devices born from our excellent ideas and technical capabilities will surely satisfy our customers' QCD (Quality, Cost, Delivery).
