【*We accept test samples!】 It is now possible to connect with the solder behavior analysis device, allowing you to set printing conditions digitally!
The "TSP-800" is a cream solder printing machine that can be linked with a rheology analyzer (solder behavior analysis device), allowing for digital setting of printing conditions. 【Features】 ■ Full digital printing condition settings possible through data input from the rheology analyzer ■ Ensures consistent quality through shared printing conditions ■ Improved printing quality through data linkage with SPI ■ Equipped with a squeegee unit controlled by motors and pneumatic pressure, enhancing quality and takt time ■ Improved board clamping performance by edge clamping all board outlines ■ Achieves high filling performance by using a TH squeegee ■ Easy exchange between M size and L size as no mask adapter is required *For more details, please download the PDF or feel free to contact us.
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basic information
<Machine Specifications> ■ Board Size: Minimum × 50mm × Y50mm to Maximum × 480mm × Y400mm ■ Mask Size: X650 × Y550, X550 × Y650, X600 × Y550, X736 × Y736 (mm) ■ Plate Making Standard: Front/XY Center ■ Machine Cycle Time: Approximately 13 seconds (based on our standard board / including printing time) ■ Squeegee Speed: 1 to 220 m/sec ■ Printing Accuracy: +0.010m ■ Machine Size: W1,180m (including 1,772mm conveyor) × D1,600m × H1,470mm ■ Weight: Approximately 1,500kg *For more details, please download the PDF or feel free to contact us.
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Since our establishment, we have consistently focused on "automation technology," accumulating advanced technical skills in the development and manufacturing of industrial automation equipment. The various FA devices born from our excellent ideas and technical capabilities will surely satisfy our customers' QCD (Quality, Cost, Delivery).
