【New Product!】Cream Solder Printing Machine 'TSP-800'

Added to bookmarks
Bookmarks list

Bookmark has been removed
Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.
Free membership registration

last updated：Feb 26, 2018

天竜精機

Official site

【*We accept test samples!】 It is now possible to connect with the solder behavior analysis device, allowing you to set printing conditions digitally!

The "TSP-800" is a cream solder printing machine that can be linked with a rheology analyzer (solder behavior analysis device), allowing for digital setting of printing conditions. 【Features】 ■ Full digital printing condition settings possible through data input from the rheology analyzer ■ Ensures consistent quality through shared printing conditions ■ Improved printing quality through data linkage with SPI ■ Equipped with a squeegee unit controlled by motors and pneumatic pressure, enhancing quality and takt time ■ Improved board clamping performance by edge clamping all board outlines ■ Achieves high filling performance by using a TH squeegee ■ Easy exchange between M size and L size as no mask adapter is required *For more details, please download the PDF or feel free to contact us.

Related Link - http://www.tenryuseiki.co.jp/products/cat01/tsp-80…

Inquire About This Product

basic information

<Machine Specifications> ■ Board Size: Minimum × 50mm × Y50mm to Maximum × 480mm × Y400mm ■ Mask Size: X650 × Y550, X550 × Y650, X600 × Y550, X736 × Y736 (mm) ■ Plate Making Standard: Front/XY Center ■ Machine Cycle Time: Approximately 13 seconds (based on our standard board / including printing time) ■ Squeegee Speed: 1 to 220 m/sec ■ Printing Accuracy: +0.010m ■ Machine Size: W1,180m (including 1,772mm conveyor) × D1,600m × H1,470mm ■ Weight: Approximately 1,500kg *For more details, please download the PDF or feel free to contact us.