Detailed examples of FPC replacements implemented in LCDs and information about the equipment owned.
This document introduces the repair of LCDs and FPCs using the ACF crimping equipment conducted by Viola Corporation. It includes an introduction to our tabletop ACF attachment device "LD-02" and the FPC alignment thermal crimping device "BD-03," as well as approximately 150,000 repair case examples. [Contents] ■ Introduction of equipment ■ Repair cases *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Features of Tabletop ACF Attachment Device】 ■ Capable of handling attachment lengths up to 60mm ■ Compatible with various workpieces such as LCDs, FPCs, and PWBs 【Features of FPC Alignment Hot Pressing Device】 ■ Easy to change setups ■ Compatible with a wide variety of workpieces *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.