Accommodating various processes! We perform semiconductor wafer processing tailored to customer needs.
At Takashima Sangyo Co., Ltd., we provide integrated processing of semiconductor wafers tailored to our customers' needs through our unique processing technology. We accommodate various processes such as back grinding, dicing, and chip tray packing. 【Features】 ■ Unique processing technology ■ Responsive to customer needs ■ Integrated processing *For more details, please refer to the PDF document or feel free to contact us.
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Takasima Sangyo Co., Ltd. is a company primarily engaged in precision parts processing, device technology processing, and the design and production of various equipment. We specialize in the precision processing of fine metal parts and difficult-to-cut materials, as well as surface treatment and hole processing using specialized techniques. Additionally, our precision, delicate, and high-precision device products guarantee high quality through consistent manufacturing management in a clean room.
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