Control of sputter pressure is possible with gas introduction and pressure control valves!
The "MSS600-3" is a three-dimensional RF sputtering device using a rectangular cathode measuring W100 x H500mm. The substrate size is W200 x H300mm, and it is deposited while being transported in the X direction. Additionally, the substrate can be set to any time between 30 seconds and 15 hours, allowing for film thickness adjustment and various types of heterogeneous layered film deposition. 【Features】 ■ Automatic sputtering function enables labor-saving long-duration sputtering work. ■ Uses a rectangular cathode manufactured by GenCore, allowing for uniform sputter gas introduction near the target. ■ The process chamber is divided into three rooms with rotating shutters to prevent sputter contamination diffusion. ■ Sputtering is possible while moving the substrate at a constant speed, among other features. *For more details, please download the PDF or feel free to contact us.
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【Specifications】 ■ Power supply voltage: AC200V, three-phase three-wire system, 50/60Hz (power supply voltage variation: ±10%) ■ Maximum current: 250A ■ Operating ambient temperature and humidity: +5 to +35℃ / up to 75% rh ■ Dimensions of the main unit (W×H×D mm): 3940×1980×1550 ■ Site dimensions of the system (W×D mm): 5000×3000 ■ Weight of the main unit (kg): 2000 *For more details, please download the PDF or feel free to contact us.
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Our company, based in Aichi Prefecture, is a spin-off from the Equipment Development Division of Hiroshima Corporation, which has been in operation for over 40 years, serving the automotive, aerospace, and chemical plant industries, as well as universities and research institutes. We excel in the manufacturing of advanced equipment that is not available in the market and in custom manufacturing.