Semiconductor device connection bar
This is a semiconductor device connection bar made from a 3.0mm copper plate. After the cutting process is completed, hole processing for 9π and 6.5π, as well as tapping at three locations, will be performed. Next, chamfering will be done, and bending will be carried out with a bender, completing the main processing. A first inspection will be conducted, followed by a final inspection after nickel plating is completed. The production time, including the plating process, is estimated to be around 2 to 3 days.
![D1GKf1QU4AAB3sy[1].jpg](https://image.mono.ipros.com/public/product/image/1a8/2000432424/IPROS3904581177387257227.jpg?w=280&h=280)
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basic information
Material: Copper plate, thickness = 3.0 mm Process: Sheet metal processing, nickel plating Application: Semiconductor device connection bar
Price range
Delivery Time
P2
Applications/Examples of results
It is used as a connection bar for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
