TySOM-3A equipped with the largest Zynq UltraScale+ MPSoC.
The TySOM-3A-ZU19EG is a compact SoC prototyping board equipped with a Zynq UltraScale+ MPSoC device that provides 64-bit processor scalability by combining real-time engine control and soft and hard engines for SoC prototyping solutions, IP verification, graphics, video, packet processing, and early software development.
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basic information
Basic Features FPGA - Xilinx Zynq UltraScale+ ZU19EG-FFVB1517 MPSoC Memory - 8GB DDR4 SODIMM memory (installed in both PS and PL) - 2 Gb NAND memory - QSPI flash memory (512Mb) - EEPROM (64 Kb) - MicroSD card slot Interfaces - HDMI 2.0 IN/OUT - DisplayPort - 2× Gigabit Ethernet PHY (DP83867CR) - Wi-Fi/Bluetooth module (WL18370MOD) - PCIe x1 GEN3/4 (Root Complex or Endpoint) - 4x USB 3.0 ports - SATA - CAN - QSFP+ - 2x8 IOs Pmod connectors - USB 2.0 OTG (micro USB connector) - UART to USB bridge with Mini-USB B type connector (CP2103) - JTAG USB module
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Applications/Examples of results
SoC prototyping solutions, IP verification, graphics, video, waveform, packet processing, and early software development, etc. AWS IoT Greengrass certified device: https://devices.amazonaws.com/detail/a3G0h0000078UUGEA2/TySOM-3A-ZU19EG-Embedded-Development-Kit
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![[Data] Performing cross-spectral video processing on the TySOM-3 board.](https://image.mono.ipros.com/public/catalog/image/01/e2f/575710/IPROS21507850396510365577.jpeg?w=120&h=170)
![[Information] Making the TySOM Zynq-based embedded development board compatible with AWS IoT Greengrass.](https://image.mono.ipros.com/public/catalog/image/01/f34/577179/IPROS80645596479152187880.jpeg?w=120&h=170)
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Company information
Aldec Japan, Inc. is a leading EDA tool vendor in the industry, releasing innovative design creation, simulation, verification solutions, and a variety of development boards, which are adopted for the development of large-scale FPGA/ASIC/SoC and embedded system designs. The fields we are involved in span various areas, including telecommunications, automotive, educational and research institutions, and the aerospace industry. Please feel free to contact us if you have any inquiries.