Semiconductor device components
This is a precision sheet metal processing product made from aluminum material (A5052P) with a thickness of 1.5mm. The main process starts with punching, followed by pre-processing and bending. After forming is completed, anodizing treatment is performed, followed by stud installation, silk screening, and final inspection. This product is used as a back plate for semiconductor equipment and requires high processing precision and tolerance dimensions. The production time, including anodizing treatment and silk screening, is estimated to be 2 to 3 days.
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basic information
Material: A5052 / t=1.5 Dimensions: 147 × 270 × 10 Process: Precision sheet metal processing Application: Semiconductor device components
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Applications/Examples of results
It is used as a back plate for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
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