Semiconductor device case
This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.0mm. The main process starts with punching, followed by pre-processing, bending, and welding. Four types of parts are bent individually using a bender and then joined by welding. After shaping is completed, painting is carried out, followed by final inspection. As this product is a precision sheet metal product, it requires high processing accuracy and tolerance dimensions. The production time, including painting, is approximately 2 to 4 days.
![DSC_8588-1024x683[1].jpg](https://image.mono.ipros.com/public/product/image/17e/2000434520/IPROS13420723884022994604.jpg?w=280&h=280)
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basic information
Material: SPCC / t=1.0 Dimensions: 50 × 80 × 100 Process: Precision sheet metal processing, welding Application: Semiconductor device case
Price range
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Applications/Examples of results
It is used as a case for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
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