By using a copper core ball, deformation of the ball is minimized, enabling 3D implementation and narrow pitch implementation.
Compared to solder balls: ◎ Excellent strength, allowing for clearance in semiconductor packages ◎ Suppresses deformation of the balls, secures space, and enables the realization of a highly reliable component structure ◎ Allows for narrow pitch mounting similar to Cu pillars ◎ Enables high heat dissipation and measures against electromigration
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Applications/Examples of results
◎ CSP (Chip Size Package), BGA (Ball Grid Array) external connection terminals ◎ Connection materials for standoffs in stacked packages ◎ POP (Package on Package) ◎ COC (Chip On Chip) ◎ Embedded package (Embedded PKG)
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Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.