High adhesion to the resin substrate due to discharge cleaning with high-frequency plasma before film formation.
The "Large Resin Substrate Deposition Device" is a large deposition system aimed at forming thin films on large resin molded parts for automotive exterior components. Equipped with multiple electron gun evaporation sources, it enables high-speed film formation at low temperatures for metal films such as Al, Cu, and Ni on large resin substrates up to 1 meter in length. It has a proven track record not only for automotive parts but also for electromagnetic wave shielding in electronic devices. The combination of a large chamber (φ2000), electron gun evaporation sources, and a large exhaust system makes it suitable for the production of high-quality decorative films and electromagnetic wave shielding films through large batch processing. 【Features】 - Low-temperature formation of various metal films (below 70°C) - Short-time batch processing - High adhesion of films to resin substrates via RF bombardment - Formation of various thin films, thick films, and multilayer films (Cu/Ni Cu1μmNi0.25μm stacking) - Stable film formation of discontinuous films - Customization options allow for full-area film formation on long substrates (up to 1750mm) *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Production of high-quality decorative films and electromagnetic shielding films through large-scale batch processing. *For more details, please refer to the PDF document or feel free to contact us.*
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Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
