High-quality cutting of composite materials is possible! Laser ablation processing machine equipped with a ultra-short pulse laser oscillator.
The "SLA Series" is a laser ablation processing machine capable of processing fluororesin films and polyimide films without burning. With a robust frame and a highly reliable galvanometer scanner, it achieves high-precision processing. It can perform fine engraving on the surfaces of various materials. Equipped with an ultra-short pulse laser oscillator (picosecond, nanosecond), it enables processing of metals, resins, ceramics, and more with minimized thermal effects. 【Features】 ■ Equipped with an ultra-short pulse laser oscillator (wavelength: green laser, UV laser) ■ Capable of processing metals, resins, ceramics, etc., with minimized thermal effects ■ Achieves high-precision processing with a robust frame and a highly reliable galvanometer scanner ■ Capable of high-quality cutting of laminated materials such as flexible printed circuits (FPC) ■ Capable of processing fluororesin films and polyimide films without burning ■ Capable of fine engraving on the surfaces of various materials *For more details, please refer to the related links or feel free to contact us.
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basic information
【Application Examples】 ■ Flexible Printed Circuit (FPC) outline cutting/splitting (depaneling) ■ ITO patterning ■ Thin film removal ■ Polymer film cutting/half-cut ■ Precision electrode cutting ■ Microchannel processing ■ Ceramics cutting/engraving ■ Display material cutting *For more details, please refer to the related links or feel free to contact us.
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Applications/Examples of results
【Example of Processed Samples (Partial)】 ■ Flexible Printed Circuit Board (FPC) Cutting ・Thickness: 300μm ■ Fluororesin Film Punching ・Thickness: 50μm ・Hole Diameter: φ50μm *For more details, please refer to the related links or feel free to contact us.
Line up（1）
| Model number | overview |
|---|---|
| SLA2021 | Fixed output nanosecond laser or picosecond laser |
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Company information
Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (such as taping machines, multifunctional test handlers, ball mount machines, and bonders). Please feel free to contact us if you have any inquiries.
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