Compatible with ultra-small components of size 0201. A substrate suitable for advanced packaging such as sub-modules and SiP, surface mount machines, and mounters!
The "SIPLACE TX micron" is a surface mount machine suitable for advanced packaging applications, capable of achieving a minimum accuracy of ±10 μm (3σ). By using "pressure control" to detect contact with the substrate before releasing components, it minimizes warping and vibrations of the substrate while preventing defects such as solder bridges. It has minimal angular error and can be implemented in tight spaces, as well as accommodating the mounting of extremely small components sized 0201 m. 【Features】 ■ Maximum mounting speed of 93,000 CPH ■ Mounting accuracy of ±10 μm (3σ) * Equipped with vacuum clamps ■ High-resolution scale made of glass ceramic ■ Advanced software algorithms * For more details, please refer to the materials. Feel free to contact us with any inquiries.
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basic information
【Specifications of SIPLACE TX micron】 ■ Machine dimensions: 1×2.23×1.45 m ■ Maximum feeder slot of 80×8 mm, JEDEC tray ■ Certification: Semi S2 / S8, Cleanroom class ISO 7 ■ Minimum placement pressure: 0.5 N * We also offer a "DEK printer" that allows printing onto wafers with a special handling system.
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Company information
ASM's Japan SMT Division was established in 1999 as the Electronic Production Systems Department within Siemens Corporation, and in 2011, the Electronic Production Systems Department was integrated into ASM Pacific Technology Group (ASMPT). We provide innovative and high-quality SMT solutions along with advanced technologies such as top-class printing and mounting solutions to Japanese electronic device manufacturers.
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