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  6. Vacuum Process Gas High-Speed Annealing Equipment "RTP/VPO Series"

Vacuum Process Gas High-Speed Annealing Equipment "RTP/VPO Series"

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last updated:May 30, 2023

ユニテンプジャパン
ユニテンプジャパン
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Maximum reaching temperature of 1,000℃! This is a high-speed annealing heating device that can be integrated into inline systems as well as for prototype development purposes.

The "RTP/VPO series" is a tabletop type high-speed annealing device for vacuum and process gases. It includes models such as "RTP-150," which is suitable for research and development requiring high purity and stability, such as the thermal oxidation process of SiC and crystal growth of GaN, as well as "RTP-100" and "VPO-1000-300." 【RTP-150 Features】 ■ Compatible with 6-inch wafers ■ Maximum achievable temperature of 1000℃ ■ Achieves linear temperature control ■ Significantly reduces the occurrence of contamination ■ Options available to accommodate various experimental environments *For more details, please refer to the PDF document or feel free to contact us.

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2019-07-10_11h52_31.png

Vacuum Process Gas High-Speed Annealing Equipment "RTP/VPO Series"

2019-07-10_11h52_31.png
2019-07-10_11h52_31.png
  • Related Link - https://www.unitemp.jp/product_top/

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【Other Features】 Maximum reaching temperature of 1000°C The device is equipped with a cooling mechanism as standard. It achieves a maximum reaching temperature of 1000°C while ensuring safety. Therefore, it can easily handle not only annealing processes for SiAu, SiAl, SiMo, etc., but also sintering processes for paste materials. Supports rapid heating/cooling Equipped with a high-speed infrared (IR) heater, it can achieve rapid heating of over 4500°C per minute (over 75°C per second). Of course, it is also possible to heat at any desired rate according to the set values in the profile program. In the cooling process, nitrogen gas is supplied into the chamber for cooling, allowing for safe cooling without damaging the surface of the device after processing. Supports a variety of gas purge environments It can be equipped with up to 4 systems of MFC (mass flow controllers), allowing for annealing in vacuum environments, atmospheric environments, and any desired process gas purge environment. The profile program can register not only ON/OFF control for various gas systems but also their flow rates, making it easy to reproduce various environments.

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【Lineup】 ■RTP-100 ■RTP-150 ■VPO-1000-300 *For more details, please refer to the PDF document or feel free to contact us.

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Vacuum Process Gas High-Speed Annealing Equipment "RTP/VPO Series"

Vacuum Process Gas High-Speed Annealing Equipment "RTP/VPO Series"

PRODUCT
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Formic acid reduction reflow tabletop vacuum solder reflow device

Formic acid reduction reflow tabletop vacuum solder reflow device

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【Reflow Equipment Problem Solving Case】 Voids Trapped Inside the Solder

【Reflow Equipment Problem Solving Case】 Voids Trapped Inside the Solder

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Reflow Equipment Problem-Solving Case: Flux Residue

Reflow Equipment Problem-Solving Case: Flux Residue

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Reflow Equipment Case Study: Characteristics of Reflowed Solder

Reflow Equipment Case Study: Characteristics of Reflowed Solder

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[Reflow Equipment Case Study] Temperature Variation within the Substrate

[Reflow Equipment Case Study] Temperature Variation within the Substrate

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ユニテンプジャパン

ユニテンプジャパン

Electronic Components and Semiconductors

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We sell and provide maintenance for a benchtop vacuum solder reflow device that enables soldering without flux and voids, as well as a benchtop vacuum process high-speed heating furnace that achieves annealing in various chamber environments such as vacuum and process gas environments.

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