Tabletop hot plate 2 models <250℃ specification / 350℃ specification>

Compact yet high-performance. Compatible with a wide range of processes.

The performance of the hot plate is a crucial factor that determines the accuracy of the photolithography process. In particular, in advanced processes that require high uniformity of film thickness, line width, and film quality, as well as in process development with temperature-sensitive materials, the performance of the hot plate becomes a significant factor in assessing process performance. The timer-controlled pin-up mechanism enables precise time management, allowing for uniform thermal treatment between wafers. In addition to the standard 250°C model, a high-temperature 350°C model is also available. Furthermore, if uniform cooling is required before and after processing, a tabletop cool plate can also be used. 【Features】 ■ High precision in in-plane temperature uniformity. ■ Timer control reduces wafer-to-wafer variation. ■ Compatible with 3 to 8-inch wafers. ■ Proximity balls ensure a uniform gap. ■ The high-temperature 350°C model is equipped with a burn prevention cover. ■ Tabletop cool plates for air cooling and water cooling are also available. *For more details, please refer to the PDF materials or feel free to contact us.

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