Epoxy resin and polyurethane resin potting alternatives. Low-pressure molding (LPM) using plant-based hot melt. Towards lightweight, high functionality, and high efficiency.
Bostik Nitta Co., Ltd. handles plant-based thermoplastic hot melt polyamide (HMPA). We can provide proposals from the initial consideration of materials and equipment to prototyping and mass production. Please feel free to contact us for more details. Our products have heat resistance up to 150°C and high adhesion strength, and are utilized for fixing and sealing waterproofing of electronic components such as substrates and sensors through low-pressure injection molding. Furthermore, low-pressure injection molding (LPM) technology plays an important role not only in sealing, filling, and fixing electronic components (automotive, electrical and electronic industries) but also in protecting products from dust, dirt, heat, and moisture. Hot melt does not require curing and contributes to improved production efficiency. 【Features】 ■ Improved production efficiency (reduced man-hours and time) ■ High design flexibility ■ Reduced material and equipment costs ■ High heat and environmental resistance ■ High functionality and adhesion strength ■ Sustainable and reusable *You can download the catalog.
Inquire About This Product
basic information
【Product Lineup (Partial)】 ■ Polyamide Hot Melt THERMELT Please feel free to contact us if you have any inquiries. * You can download the Japanese catalog. * For more details, please refer to the PDF materials or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Lineup (Partial)】 ■ Connectors and Coils ■ Various PCB Boards and Electronic Circuits ■ Various Sensors (Temperature, Pressure, etc.) * You can download the Japanese catalog. * For more details, please refer to the PDF materials or feel free to contact us.
Detailed information
-
Thermoplastic hot melt polyamide product lineup
catalog（3）
Download All Catalogs
![Hot Melt Adhesive [Product Catalog]](https://image.mono.ipros.com/public/catalog/image/01/ae5/613293/IPROS43041454225587011077.jpeg?w=120&h=170)
![High-Performance Hot Melt Solutions [Technical Selection Guide]](https://image.mono.ipros.com/public/catalog/image/01/4af/594358/IPROS42250099805293995248.jpeg?w=120&h=170)
Company information
Bostik has developed excellent technologies that not only simply adhere objects but have also brought advancements to people's daily lives for over a century. **The Gecko is the Symbol of Bostik** For centuries, the powerful adhesion mechanism of a gecko's feet has been a fascinating subject for researchers. Geckos can adhere to most surfaces and can easily run on smooth glass at a speed of one meter per second, supporting their entire weight with just one toe of one foot. Bostik has adopted the gecko, inspired by nature, along with the slogan logo "Smart Adhesives," to express the relevance of Bostik's "Smart Adhesives" business based on scientific evidence. The gecko logo meets the criteria of smartness, high efficiency, and excellent adaptability, addressing Bostik's transformative challenges and continuing to create new possibilities in the adhesive market alongside Bostik. Bostik's gecko and our smart products provide smarter adhesives across various industries, both in B2B and online sales.
