Many achievements in the Tohoku region! Can also be used as cushioning packaging material for heavy objects! This is a resin that has successfully strengthened the hinge area significantly.
The "Suntech Foam TH Series" is a foam resin that eliminates the cutting and pasting process from the conventional "Suntech Foam" cushioning packaging material, thanks to its unique special skin processing technology, while also achieving significant reinforcement of the hinge area. This product offers various advantages, including reduced delivery times, substantial cuts in processing, storage, and transportation costs, as well as enhanced hinge strength to prevent tearing and separation due to impact, making it suitable not only for lightweight items but also for cushioning packaging of heavy items. 【Features】 ■ Simple design that allows for cushioning packaging material to be obtained just by setting up the hinge part on-site ■ Special skin and foam parts are made from the same material (cross-linking polyethylene) ■ Easy to recycle ■ Possible to shorten delivery times ■ Significant reduction in processing, storage, and transportation costs *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■ Cushioning materials, surface protection materials, thermal insulation materials, sports equipment, packaging and shipping for precision instruments and electronic devices ■ High-performance cushioning packaging materials, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Whether it is [one-way] or [commuting], whether cushioning is necessary, and the effects of static electricity... the optimal materials vary depending on the contents. We will propose improvements to the packaging format for the 2024 issue. Tohoku Ueno Co., Ltd. will utilize the many packaging examples we have cultivated so far and various new materials developed in recent years to solve environmental issues, offering the best combinations. We will consider all aspects, including cost, material selection, processing methods, and environmental factors, to meet our customers' needs. We will conduct drop tests using the drop tester from Ransomont, analyze the shock waveforms with test partners, and propose optimal cushioning packaging designs.
![[For Tohoku Base] Packaging Materials, Wrapping Materials, Foam Resin ECM](https://image.mono.ipros.com/public/product/image/a7e/2000467008/IPROS38293889142747444181.png?w=280&h=280)
