Laser shape processing: Cutting of brittle ceramic materials.
Cutting (full cut) of brittle and very fragile ceramic thin plates can be performed using ultrashort pulse lasers. Processing with ultrashort pulse lasers does not directly contact the workpiece, resulting in minimal impact on the workpiece. Additionally, since non-thermal processing is possible, there is very little burr formation during processing. Material: Ceramic / Thickness: 200μm
Inquire About This Product
basic information
Cutting (full cut) of brittle and very fragile ceramic thin plates can be performed using ultrashort pulse lasers. Processing with ultrashort pulse lasers does not directly contact the workpiece, resulting in minimal impact on it. Additionally, since non-thermal processing is possible, there is very little burr formation during machining. Material: Ceramic / Thickness: 200μm
Price range
Delivery Time
Applications/Examples of results
Material: Ceramic / Thickness: 200μm
catalog（4）
Download All Catalogs
Company information
At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!
![[Video Available] Introduction of Bending Processing Case 19](https://image.mono.ipros.com/public/product/image/285/2000284433/IPROS6972517058345895332.JPG?w=280&h=280)
![[Processing Business] Cutting](https://image.mono.ipros.com/public/product/image/979/2000635520/IPROS40470580704882628172.png?w=280&h=280)
![[Semiconductor/Class 100 Compatible] 100% Water-Free Air Nozzle](https://image.mono.ipros.com/public/product/image/2116982/IPROS15202438644694791694.png?w=280&h=280)
