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  6. Laser micromachining: Cutting processing of chemically strengthened glass

Laser micromachining: Cutting processing of chemically strengthened glass

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last updated:Sep 18, 2019

光機械製作所 HIKARI LASER LAB.
光機械製作所 HIKARI LASER LAB.
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Micro cutting of chemically strengthened glass using ultrashort pulse lasers.

By utilizing filamentation with a ultrashort pulse laser for scribing inside glass, it is possible to cut even chemically strengthened glass without causing cracks or breakage. The cutting width is narrow due to fine processing, resulting in a flat cutting surface with a roughness of less than 2μm. Scribing can be applied to glass before chemical strengthening and can also serve as a starting point for breaking. Material: Chemically strengthened glass Thickness: 700μm http://www.hikarikikai.co.jp/laser/

    Semiconductor inspection/test equipmentContract manufacturingProcessing Contract
ゴリラガラス.jpg

Laser micromachining: Cutting processing of chemically strengthened glass

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ゴリラガラス.jpg

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By utilizing filamentation with a femtosecond pulse laser for scribing inside glass, it is possible to cut even chemically strengthened glass without causing cracks or breakage. The cutting width is small due to fine processing, resulting in a flat cutting surface with a roughness of less than 2μm. Scribing can be applied to glass before chemical strengthening and can also serve as a starting point for breaking. Material: Chemically strengthened glass Thickness: 700μm

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Material: Chemically strengthened glass Thickness: 700μm

catalog(4)

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Characteristics and History of Ultrashort Pulse Lasers

Characteristics and History of Ultrashort Pulse Lasers

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Internal Modification of Glass by Laser Micromachining and Principles of Marking

Internal Modification of Glass by Laser Micromachining and Principles of Marking

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Laser Micromachining Thin Film Processing Case Studies Thickness Below 50μ

Laser Micromachining Thin Film Processing Case Studies Thickness Below 50μ

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Laser microfabrication: Through holes in glass.

Laser microfabrication: Through holes in glass.

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Company information

光機械製作所

光機械製作所 HIKARI LASER LAB.

Manufacturing and processing contract

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At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!

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