Like production silicon wafers, it is effective simply by being transported automatically.
Introducing the "Chuck Cleaning Wafer (CCW)." This technology removes debris/particles from the chuck. With a simple usage method, it reduces dummy wafer loss and minimizes equipment downtime. It is expected to be effective not only in photolithography but also in etching and sputtering processes. 【Features】 ■ 3D processing tailored to the surface shape of the chuck is possible ■ Cleaning wafers can be regenerated with a dedicated maintenance sheet ■ Removes debris/particles from the chuck ■ Functions effectively just by flowing through automatic transport, similar to production silicon wafers *For more details, please refer to the PDF document or feel free to contact us.
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【Available Sizes】 ■ Adhesive Type: φ100mm to φ300mm ■ Coated Type: φ200mm to φ300mm *For more details, please refer to the PDF document or feel free to contact us.
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【Processes with Expected Effects】 ■Photolithography ■Etching ■Sputtering *For more details, please refer to the PDF document or feel free to contact us.
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A company that can respond instantly to the rapidly changing information society, that is Kyodo International. It has been 50 years since the company was founded. And a new challenge! We will face difficulties more strongly and boldly than ever. We look forward to your continued support.