Processing of ultra-thin, high flatness products made from Mo (molybdenum) and its alloys.
Molybdenum (Mo) and tungsten (W) are metals with high density, high melting points, and low thermal expansion coefficients. By adjusting the ratios of MoCu and WCu alloys, optimal thermal expansion coefficient materials are created, which are used as heat sinks for semiconductor LED chips. The radiation shielding properties of Mo and W are also commonly utilized in medical device components.
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basic information
High-precision processing of heat sinks for LED chips Materials: Mo, MoCu, W, WCu Sizes: 2, 4, 6 inches, thickness from 0.01mm Surface roughness: Ra 0.01 and above Surface plating available: Ni, Au
Price range
P1
Delivery Time
P4
Applications/Examples of results
Heat sink for LED chips 85MoCu, 6 inches, thickness 0.1mm 3000 pieces/month
Detailed information
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Mo Molybdenum Sheet Standard: ASTM B386 Impurity content: <=0.04% Mo Content: >=99.5% Technique: extruding, forging, rolling Size: (0.2~16.0mm) thickness x (10~600mm) width x length
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Mo, MoCu Wafer 85MoCu Wafer Mo 85%, Cu 15% 6 inch, thickness 0.1 mm
Company information
We are a trading company specializing in material supply and contract processing of parts. We provide materials and products such as ceramics, quartz glass, engineering plastics, pure metals, and alloys to major semiconductor, industrial, and electrical industry companies in Japan. We support our customers' businesses with a three-pronged approach of technical expertise, cost, and quality, from meeting quality and price requirements to material selection proposals!
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