Processing of ultra-thin, high flatness products made from Mo (molybdenum) and its alloys.
Molybdenum (Mo) and tungsten (W) are metals with high density, high melting points, and low thermal expansion coefficients. By adjusting the ratio of MoCu and WCu alloys, optimal materials with suitable thermal expansion coefficients are created, which are applied as heat sinks for semiconductor LED chips. The radiation shielding properties of Mo and W are also commonly used in medical device components.
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basic information
Mo Molybdenum Epi Wafer Mo, MoCu, W, WCu materials, 2, 4, 6 inch, thickness 0.01mm and above Surface roughness: Ra 0.01 and above, mirror polished processing
Price range
P1
Delivery Time
P4
Applications/Examples of results
Mo, 85MoCu Molybdenum Epi Wafer 85MoCu, 6 inch thickness 0.3 mm Ra 0.01 surface mirror polishing process
Company information
We are a trading company specializing in material supply and contract processing of parts. We provide materials and products such as ceramics, quartz glass, engineering plastics, pure metals, and alloys to major semiconductor, industrial, and electrical industry companies in Japan. We support our customers' businesses with a three-pronged approach of technical expertise, cost, and quality, from meeting quality and price requirements to material selection proposals!
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