Ideal for research and development of advanced thin film devices. A customizable single-sheet ultra-high vacuum inline system. Responding to demands with a wealth of options and flexible support.
A super high vacuum sputtering device with exhaust performance of 10⁻⁷ Pa. It is equipped with a cassette chamber, transfer chamber, etching chamber, and multiple sputtering chambers in a standard configuration. It achieves efficiency in research and development work through fully automated operation using a fully automatic CtC method. You can also choose deposition mechanisms such as high-efficiency ferromagnetic cathodes and wide erosion cathodes, and we can accommodate individual requirements based on substrates and purposes. It can also support a simple device configuration, achieving reasonable cost solutions. As an advanced specification, a cluster-type transfer chamber can be equipped, and it is an evolved sputtering device capable of incorporating different process chambers such as annealing and deposition.
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basic information
Standard inline type Standard 6-chamber configuration (load lock chamber, cassette chamber, transport chamber, 3 sputter chambers) Sheet-type CtC system Achievable pressure: 10⁻⁷ pa Order (sputter chamber) Target substrate: φ2 to 4 inches Optional features High-efficiency ferromagnetic cathode, substrate magnetization mechanism, etching chamber Customization support
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Applications/Examples of results
Magnetic device development Compound semiconductor development Thin film semiconductor research and development
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Shinkou Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.