Cost reduction case studies for transportation, packaging, and logistics for the Tohoku factory: Low G-value cushioning design.
Designing cushioning for fragile objects with high-performance cushioning materials! Achieving design while considering material cost reduction.
We would like to introduce an example of cushioning design for fragile objects using high-performance cushioning materials. When transporting precision instruments that can break or malfunction from slight impacts, a design that can protect the object from various angles is required. In our case, we can achieve a design that also considers material cost reduction through the packaging technology we have accumulated over many years. If you are looking for cost-competitive transport boxes for precision instruments, please feel free to contact us. 【Example Overview】 ■ By Application: Cushioning/Protective Packaging/Grouping/Overseas Shipping ■ By Industry: Electronics/Precision Instruments/Semiconductors/Aerospace/Freight/Transport ■ By Material Function: Material Cost Reduction ■ Classification List by Packaging Name: - Precision Instruments/ Machine Tools/ Tools/ Measuring and Inspection Equipment/ Semiconductors and Electronic Components ■ By Packaging Material: Foam Materials ■ By Purpose: Protecting Products *For more details, please refer to the PDF document or feel free to contact us.
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Whether it is [one-way] or [commuting], whether cushioning is necessary, and the effects of static electricity... the optimal materials vary depending on the contents. We will propose improvements to the packaging format for the 2024 issue. Tohoku Ueno Co., Ltd. will utilize the many packaging examples we have cultivated so far and various new materials developed in recent years to solve environmental issues, offering the best combinations. We will consider all aspects, including cost, material selection, processing methods, and environmental factors, to meet our customers' needs. We will conduct drop tests using the drop tester from Ransomont, analyze the shock waveforms with test partners, and propose optimal cushioning packaging designs.
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