Copper sulfate plating additive for printed wiring boards (PWB) significantly improves via filling characteristics and uniformity of pattern plating thickness.
With the miniaturization and high performance of electronic devices, semiconductor devices are also becoming finer and more functional, and there is a growing demand for further miniaturization of wiring and reduction of via diameter in semiconductor package substrates that connect semiconductor devices to main substrates. Additionally, copper sulfate plating is required to have both high via filling capability and uniform plating thickness simultaneously. Okuno Pharmaceutical Industry has solved these challenges. Here’s what’s amazing! ◆ Copper sulfate plating additive for via filling: Topluchina GAP ◆ - Excellent uniformity of plating thickness in pattern plating - Reduces variation in plating thickness due to pattern density differences - Reduces variation in wiring width - Capable of filling large diameter blind via holes - Enables uniform electrowinning with excellent electric copper plating - Compatible with various via diameters - Excellent thermal shock resistance - Performs well across a wide current density (1.0 to 2.0 A/dm²) - Achieves high filling capability in baths with high sulfuric acid concentration - Allows for analysis of all additive components Our specialized sales representatives will propose the perfect chemicals and processes for you. Please feel free to consult us about anything.
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basic information
Okuno Pharmaceutical Industry manufactures and sells the following products: 1. Plating and surface treatment chemicals for printed circuit boards and electronic components 2. Plating and surface treatment chemicals for metals and plastics 3. Plating, anodizing (alumite), and surface treatment chemicals for aluminum and magnesium 4. Electroless nickel and other electroless plating solutions 5. Powder glass and glass paste for electronic materials and electronic components 6. Powder glass and glass paste for vehicles, construction materials, industry, and glass decoration 7. Food additives, quality improvers, and texture enhancers 8. Commercial formulations for hygiene management and sanitation At Okuno Pharmaceutical Industry Co., Ltd., approximately 30% of our employees are researchers engaged in daily research and development activities for "manufacturing for manufacturing." We not only propose chemicals and processes that perfectly suit our customers but also provide technical guidance and introductions to contractors, so please feel free to contact us.
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Computers, smartphones, tablet computers, high-performance electronic devices, etc.
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Company information
Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.