We will accommodate specifications according to your requests, such as the presence or absence of laser marks, surface condition, and metal contamination!
D&X Corporation handles "Bare Wafers." We offer grades of Prime (high flatness, specified resistance values, specified edge shapes, specified thickness, etc.) wafers, Low particle wafers, recycled wafers, and coin roll wafers. Additionally, we can accommodate specifications according to your requests, such as Low haze, presence or absence of laser marks (code specification available), dopants, crystal orientation, notches (oriflap), surface conditions, and metal contamination. 【Product Overview】 ■ Supported sizes: Diameter 50–450mm ■ Handling manufacturers: SEH, SUMCO, Global Wafers, Siltronic, SK Siltron, and others ■ Special wafers: SOI, epi, glass, quartz, compound wafers, etc. ■ Supported grades: - Prime wafers, Low particle wafers, recycled wafers, coin roll wafers *For more details, please refer to the PDF document or feel free to contact us.
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1. Dicing tape; BG (Back Grinding) tape; Dicing tape; Protective tape for back grinding of wafers. 2. Silicon wafer for semiconductors: Polished wafer (PW) annealed wafer, epitaxial wafer (EW), epitaxial wafer with embedded layer (JIW), SOI wafer, reclaimed wafer (RPW). 3. Lamp; low-pressure lamp; high-pressure lamp. 4. UV machine; Dicer; UV irradiator; tape expansion device; tape application device; ultraviolet irradiation device; ultraviolet dry cleaning device.