High adhesion to prevent water infiltration! We offer two types of protective tape for back grinding processes: UV type and Non-UV type!
D&X Corporation offers "Back Grind Tape." We provide two types of protective tapes for the back grind process: a UV type that allows tape removal without stressing the wafer due to reduced adhesive strength from UV exposure, and a Non-UV type with low adhesion for gentle removal. We also accommodate specification changes and the development of new types based on your requests. We can handle prototypes starting from small quantities, so please contact us for inquiries. 【Features】 ■ High adhesion that prevents water ingress ■ No adhesive residue, preventing contamination of the substrate ■ High flatness for grinding processes ■ Conforms to uneven surfaces *For more details, please refer to the PDF document or feel free to contact us.
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【Other Response Elements】 ■Reduction of warping during ultra-thin grinding ■Heat resistance during grinding/polishing ■Long-lasting high heat resistance through coating ■Static prevention during peeling ■Acid/base resistance, chemical resistance ■Protective tape for high bumps *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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1. Dicing tape; BG (Back Grinding) tape; Dicing tape; Protective tape for back grinding of wafers. 2. Silicon wafer for semiconductors: Polished wafer (PW) annealed wafer, epitaxial wafer (EW), epitaxial wafer with embedded layer (JIW), SOI wafer, reclaimed wafer (RPW). 3. Lamp; low-pressure lamp; high-pressure lamp. 4. UV machine; Dicer; UV irradiator; tape expansion device; tape application device; ultraviolet irradiation device; ultraviolet dry cleaning device.