865 Ceramabond Heat-Resistant Ceramic Adhesive Aluminum Nitride
865 Serama Bond Heat-Resistant Ceramic Adhesive Aluminum Nitride Boron Nitride
Heat-resistant ceramic adhesive 865 Odec, adhesive for high thermal conductivity ceramics (aluminum nitride, boron nitride), etc.
It is based on aluminum nitride, has high thermal conductivity, and is insulating. It is used for bonding ceramics and metals, as well as ceramics to each other, in sensors and other applications where thermal conductivity is required.
Inquire About This Product
basic information
Ceramabond 865 is a high-temperature ceramic adhesive developed by Aremco, filled with fine powder of aluminum nitride. It is used for bonding ceramics, metals, semiconductors, and other materials that require high heat resistance and high thermal conductivity. Ceramabond 865 is a one-component, water-soluble adhesive that contains no organic solvents and uses potassium silicate as a binder. Its heat resistance limit is 1,650°C.
Price range
Delivery Time
Applications/Examples of results
It is used for bonding ceramics, metals, semiconductors, and other materials that require high heat resistance and high thermal conductivity. Ceramabond 865 is a water-soluble, one-component adhesive filled with aluminum nitride and uses potassium silicate as a binder, and it does not contain organic solvents. The heat resistance limit is 1,650°C.
Company information
Tool System Co., Ltd. is a company located in Suruga Ward, Shizuoka City, Shizuoka Prefecture, that deals in machine tools, cutting tools, clamps, and chemical products.
