Digital display on the screen! Measuring the amplitude of tools used with the wire bonder.
The "ODS 20" is a testing device used to measure the amplitude of tools used in wire bonders and die bonders. Not only does it measure the amplitude of bonding tools, but by equipping a load cell in the amplitude measurement sensor section, it can also measure the bonding weight. As before, the tool is set within a safe visible red laser, and the amplitude of the tool is measured. The measured values are digitally displayed on the screen. 【Features】 ■ Measures the amplitude (μm) of the wedge/capillary of wire bonders and the collet of die bonders. ■ By equipping a load cell (optional), it measures the bonding weight values. ■ Displays measurement results digitally on a graphic LCD display. ■ By installing software on a PC, it improves bond quality through the supply and management of measurement data. ■ Adopts a dual professor system, enabling communication interface with the bonder. ■ Due to non-reflective measurement, installation and measurement can be performed quickly compared to laser Doppler. *For more details, please refer to the PDF materials or feel free to contact us.
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【Specifications (Excerpt)】 ■Purpose: Evaluation of bonding tool amplitude and weighted values ■Measurement details: Measurement of mechanical amplitude (Peak to Peak), frequency, and weighted values ■Power type: Plug-in power supply ■Input voltage: 100 - 240V AC 50/60Hz ■Output voltage: 12V DC ■Operating current: Max 1.0A ■Laser sensor: 64.0mm(W)×21.0mm(H)×15.0mm(D) (40g) ■Main unit: 155.0mm(W)×90.0mm(H)×204.0mm(D) (1100g) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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At Eltech Co., Ltd., we provide semiconductor manufacturing equipment utilizing cutting-edge technology, including wire bonders, ultrasonic oscillators, and bonding tools. We offer a range of products starting with the tabletop semi-automatic wire bonder "MODEL 56i series," as well as the MODEL 53 series manual wire bonder for research and development/small-scale production purposes, and the M17 automatic wire bonder for production applications. Please feel free to contact us if you have any inquiries.