We have a proven track record with a variety of chemical solutions! The reason for our low prices is that we handle everything in-house, from design to sales.
Our equipment can process substrates, such as those coated with roll coaters or spray coaters, using spin coating! It is a rotary cup-type coating device that can apply spin coating on elongated rectangular substrates, square-like substrates, substrates with steps, and thick films (patented). We offer a lineup tailored to production volume, ranging from manual machines to fully automatic machines. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. We have a proven track record with a variety of chemicals, including polyimide, SOG, WAX, and silicone. 【Features】 ■ Achieves low prices ■ Patented rotary cup coating method ■ Proven track record with a variety of chemicals ■ Reduced footprint ■ Numerous options with minimal resist ■ Lineup tailored to production volume *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
【Main Specifications】 ■Cassette Stage: 2 sets ■Spin Coating Unit: 2 sets ■Wafer Size: Φ2" to Φ12" ■Resist Dropping Nozzle: 2 sets ■Bake Unit: 2 sets (Max 200℃) ■Cooling Unit: 1 set ■Centering Unit: 1 set ■Device Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.