We are confident in applying high-viscosity photoresist! For 10,000 cP polyimide, the standard uniformity within the plane is within ±5%, with a proven record of within ±3%.
We have numerous achievements in applying high-viscosity photoresists and polyimide! This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. It is also compatible with bellows pumps and syringes! We design and manufacture from manual machines to fully automatic machines according to the customer's production volume. We have a proven track record with various chemicals such as polyimide, SOG, WAX, and silicone. 【Features】 ■ High uniformity even with high-viscosity coatings (single coat) ■ Achieves low cost ■ Automatic size recognition ■ Proven track record with a variety of chemicals ■ Reduced footprint ■ Many options with minimal resist ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■Cassette Stage: 2 sets ■Spin Coating Unit: 2 sets ■Wafer Size: Φ2" to Φ12" ■Resist Dropping Nozzle: 2 sets ■Bake Unit: 2 sets (Max 200℃) ■Cooling Unit: 1 set ■Centering Unit: 1 set ■Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
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