This is a coater with minimal in-plane uniformity of the resist film and small differences in average film thickness between wafers. It supports low to high viscosity resist (up to 10,000 cP)!
This is a fully automated resist coating device using robot transport. It features high uniformity, reduced chemical usage, and the ability to use multiple chemicals. We can customize it to meet specifications for low to high viscosity resists. We have a proven track record with a variety of chemicals, including positive and negative resists, polyimide, SOG, wax, and silicone. We also have extensive experience in transporting various substrates such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, ceramics, and SiO2 (glass). We have numerous achievements in transporting thin substrates like GaAs (thickness 150um), InP (thickness 150um), and LT (thickness 120um)! Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices! 【Features】 - High uniformity of film thickness distribution through the spin process - Compatible with wafer sizes from 2 to 12 inches - Supports low to high viscosity (1.7cP to 10000cP) - Automatic wafer size detection function - Proven track record with a variety of chemicals - Reduced footprint (space-saving) - Numerous options for resist reduction - Lineup tailored to production volume We have a demo setup available, so please consider scheduling a demonstration first!
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basic information
We can manufacture devices ranging from 2 inches to 12 inches (12.7 to 300 mm). Depending on the wafer, we also provide FOUP (Front Opening Unified Pod) compatibility and the production of carriers. We handle compact devices for small-diameter compound substrates such as Si substrates, GaAs, GaN, LT, and LN. With a cup structure that can be used for both open and closed systems, we accommodate a wide range of resists from high viscosity to low viscosity. 【Main Specifications Example】 ■ Cassette Stage: 2 sets ■ Spin Coating Unit: 2 sets ■ Wafer Size: Φ2" to Φ12" ■ Resist Dropping Nozzle: 2 sets/CUP ■ Edge and Back Rinse: 1 set each/CUP ■ Bake Unit: 2 sets (Max 200℃) ■ Cooling Unit: 1 set ■ Centering Unit: 1 set ■ Device Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■ Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available!
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
