After spin coating BARC and other chemical solutions, it can be baked at a maximum of 400°C! Automatic resist coating device with high-temperature baking capability.
The product is equipped with spin coating, HMDS treatment, high-temperature baking (MAX 400℃), low-temperature baking (MAX 200℃), and cooling functions. Step baking is also possible with the combination of low-temperature and high-temperature baking. High-temperature baking is possible after spin coating with chemicals other than resist! Additionally, we have a proven track record with various chemicals including positive resist, negative resist, polyimide (PI), silicone, SOG, WAX, and many others! We also have extensive experience in substrate transport for various materials such as silicon (Si), sapphire, ceramic, LT, GaAs, InP, GaN, SiC, and SiO2 (glass). Rest assured with thin substrates like GaAs (thickness 150um), InP (thickness 150um), and LT (thickness 120um)! 【Features and Strengths】 ■ Achieves affordable pricing ■ Automatic wafer size detection function ■ Equipped with automatic wafer detection function (mapping) ■ Compatible with wafer sizes from 2 to 12 inches ■ Supports low to high viscosity (1.7cP to 10000cP) ■ Proven track record with a variety of chemicals ■ Reduction of footprint (space-saving) ■ Numerous options available with resist reduction *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■ Cassette Stage: 2 sets ■ Spin Coating Unit: 1 set ■ Wafer Size: Φ2" to Φ12" ■ Resist Dropping Nozzle: 2 sets/CUP ■ Back and Edge Rinse: 1 set each/CUP ■ High-Temperature Bake Unit: 1 set (Max 400℃) ■ Low-Temperature Bake Unit: 2 sets (Max 200℃) ■ Cooling Unit: 1 set ■ Centering Unit: 1 set ■ Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■ Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 6 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
