Warped wafers are also transported! Belt conveyor type automatic resist coating device (coater)
This is a belt conveyor type track system spin coater. It offers high throughput while being capable of transporting any warped wafer!
【Features】 ■ High throughput with belt conveyance (high processing capacity) ■ Capable of transporting warped wafers! ■ Achieves low cost ■ Automatic wafer size recognition system ■ Proven performance with a variety of chemicals ■ Reduced footprint ■ Many options with minimal resist ■ Lineup tailored to production volume Achieve high throughput without using robots! This is a spin coater with belt conveyance. Due to the track system (belt conveyance), transporting warped wafers is not a problem. While robots offer high flexibility in transport flow, if the coating and baking processes follow a fixed transport flow, large-scale processing is possible by using a parallel transport system (suitable for mass production). This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. We offer a lineup tailored to production volume even for fully automatic machines. By handling everything from design to manufacturing and sales in-house, we have achieved low prices. We have proven performance with a variety of chemicals such as polyimide, SOG, WAX, and silicone. *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■Cassette Stage: 2 sets ■Spin Coating Unit: 2 sets ■Wafer Size: Φ2" to Φ12" ■Resist Dropping Nozzle: 1 set/CUP ■Bake Unit: 2 sets (Max 200℃) ■Cooling Unit: 2 sets ■Centering Unit: 2 sets ■Device Size: (Example) 1800×1000×1400 (Φ4" main body) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price information
We will present it according to your desired specifications.
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
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