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  6. Cylindrical grinding

Cylindrical grinding

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last updated:Mar 19, 2020

エムワン精工
エムワン精工
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At M1 Seiko, we have extensive experience and know-how in "cylindrical grinding," providing processing at the micron level. In response to customer demands for higher precision products, we also perform work to increase the hardness of the center hole through heat treatment, followed by lapping with a conical lap bar after grinding. By following such processes, the center hole, which serves as the standard for the product, can maintain high precision, allowing for finishing using a stable reference center hole even during subsequent additional processing or dimensional changes. 【Commitment to Shaft Precision】 - When processing high-precision shafts such as spindles and precision shafts, we always use dedicated grinding machines for center hole grinding. - By grinding the hardened center hole, we prevent sagging during cylindrical grinding and reduce wear resistance with dedicated molybdenum grease, improving roundness and cylindrical accuracy. *For more details, please refer to the PDF document or feel free to contact us.

    Wafer processing/polishing equipmentProcessing Contract
center_grinding.jpg

Cylindrical grinding

center_grinding.jpg
center_grinding.jpg
  • Related Link - http://www.m1-seiko.co.jp/products_cylindrical_gri…

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【Micron-level machining precision】 - We can handle machining with a roundness of 1 micron and variations of 1 micron in each part, as well as extremely strict precision requirements such as achieving over 90% on external diameter taper gauges. - We provide verified data using our in-house roundness measuring equipment according to customer requests. *For more details, please refer to the PDF document or feel free to contact us.

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Cylindrical grinding

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エムワン精工

エムワン精工

Manufacturing and processing contract

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M1 Seiko Co., Ltd. is located in Ota Ward, Tokyo (Kamata area), where some of the country's top skilled craftsmen compete fiercely, and specializes in high-precision products in the micron to sub-micron range. The processing fields include a wide range of techniques such as polishing, turning, milling, jig grinding, gear grinding, form grinding, centerless (dead tools), NC turning, machining, wire cutting, and electrical discharge machining, catering to everything from parts to equipment, metals to resins, small items to medium-sized products, and from custom-made single items to mass production. We also focus on providing ideas and know-how, including design and development, and have a proven track record of solving problems for difficult jobs that other companies have declined or for items that did not meet the required precision or performance. Among the aforementioned processing fields, several of our core products have received such high praise from discerning customers that they have stated for many years, "We cannot find an alternative supplier."

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