For applications requiring heat dissipation measures and heat resistance. Compatible with various materials such as copper and ceramics.
Our company specializes in the design and manufacturing of high-frequency substrates that meet various needs such as "high thermal conductivity," "high strength," and "miniaturization." In applications where heat dissipation measures are particularly required, such as high-speed wireless communication, we can design to conduct heat from heat-generating components to copper-based substrates via through-holes rather than through insulation layers. [Proposal Examples] ■ High thermal conductivity → Copper-based fluoropolymer substrates ■ Low loss & high thermal conductivity → DPC substrates (ceramic wiring substrates using plating methods) ■ Miniaturization (RF section, control section separation) → Bonding of fluoropolymer substrates and FR-4 substrates *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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【Copper Base Compatible Fluorine-based Substrate Specifications Example】 <Single Layer> - Pattern Copper Foil Foil Thickness: 35, 70, (105) μm - Base Copper Thickness: 0.2, 0.3, 0.5, 1, 2, 3 mm Thermal Conductivity: 391 W/m·K (Oxygen-free Copper), 381 W/m·K (Tough Pitch Copper) <Double Layer, Four Layer> - Pattern Copper Foil Foil Thickness: 35, 70, (105) μm - Insulation Layer Thickness: 0.08 to 0.2 mm Thermal Conductivity: 0.3 to 0.4 W/m·K - Base Copper Thickness: 0.2, 0.3, 0.5, 1, 2, 3 mm Thermal Conductivity: 391 W/m·K (Oxygen-free Copper), 381 W/m·K (Tough Pitch Copper) *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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*For more details, please refer to the materials. Feel free to contact us as well.*
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Company information
Located in Chino City, Nagano Prefecture, we are a printed circuit board manufacturer that offers services from design to implementation on circuit boards, from prototype development products to mass production. We have extensive experience in thermal management boards and can propose the most suitable materials and structures for our customers' applications. Additionally, in recent years, we have also been accommodating thick copper boards for high current applications with various substrates.