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  5. Visual Inspection Equipment
  6. Ultra-high-speed wire bond 3D appearance inspection device

Ultra-high-speed wire bond 3D appearance inspection device

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last updated:Aug 30, 2022

アローズエンジニアリング
アローズエンジニアリング
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It is a short-time inspection, 3D measurement, high-precision, customizable appearance inspection device.

This device is an image processing system that performs visual inspection of wires and bonding on a substrate at ultra-high speed (1 field per second). It consists of two stations: a three-dimensional image processing unit that measures the height of the wires and a high-resolution two-dimensional image processing unit that measures wire bending and ball placement. The two-dimensional and three-dimensional image processing units operate alternately, and there are two image processing PCs. All cameras are fixed, and the mechanical device moves the substrate. ■ Example of Device Configuration (Two-Dimensional Image Processing Unit) - 5-megapixel CCD camera - Lens with magnification of 1.5x - Blue LED dome coaxial illumination - LED power supply 3HC (Three-Dimensional Processing Unit) - 1.3-megapixel CCD camera - CCTV lens f=50mm - Red LED dome illumination - Image processing PC and camera capture board

    Visual Inspection Equipment
ワイヤーボンド3次元外観検査装置.png

Ultra-high-speed wire bond 3D appearance inspection device

ワイヤーボンド3次元外観検査装置.png
ワイヤーボンド3次元外観検査装置.png
  • Special site - Product/service details - https://pr.mono.ipros.com/arrowseng/product/

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Appearance inspection of wire bonding on substrates.

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Ultra-high-speed wire bond 3D appearance inspection device

Ultra-high-speed wire bond 3D appearance inspection device

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アローズエンジニアリング

アローズエンジニアリング

Testing, Analysis and Measurement

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Since our company's establishment in 1986, we have long been engaged in semiconductor-related businesses that support Japan's cutting-edge technology. On the hardware side, we have developed construction and manufacturing environments, including clean rooms. On the human resources side, we have focused on training semiconductor engineers and establishing a service system that can promptly respond to customer needs. Last year, we participated in SEMICON Japan for the first time, and by directly interacting with many industry stakeholders, we were able to learn again what is currently needed and what services should be created. At the same time, the morale within the company has been rising, and we are actively conducting sales activities. It is said that the Japanese economy is finally showing signs of recovery. However, even just looking at the semiconductor industry, the entry of overseas manufacturers and the significant improvement in technology and services are remarkable, so we aim to enhance our international competitiveness in our sales expansion. Not only domestically but also in response to the era of globalization, our role as a hub connecting North America and Asia, especially given our excellent airport access, will further increase.

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