No need for setup changes, it's a dual-size wafer compatible device. Compatible with low to high viscosity resist! Equipment for any wafer size can be manufactured!
The product is equipped with spin coating, HMDS treatment, baking, and cooling functions. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices! We have a proven track record with a variety of chemicals including positive-negative resist, polyimide, SOG, wax, and silicone. We also have extensive experience in transporting various substrates such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, and SiO2 (glass). We have numerous achievements in transporting thin substrates like GaAs (thickness 150um), InP (thickness 150um), and LT (thickness 120um)! 【Features】 ■ No setup change required, capable of processing wafers in 2 sizes. ■ Achieves low prices. ■ Capable of handling low to high viscosity (1.7cP to 10000cP). ■ Compatible with 2 to 12-inch wafers. ■ Automatic wafer size recognition. ■ Proven track record with a variety of chemicals. ■ Reduced footprint (space-saving). ■ Numerous options for resist reduction. ■ Lineup tailored to production volume. *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■Cassette Stage: 2 sets ■Spin Coating Unit: 1 set ■Spin Development Unit: 1 set ■Wafer Size: Φ2" to Φ12" ■Resist Dropping Nozzle: 1 set ■Back Edge Rinse: 1 set / Coating CUP ■Development Nozzle: 1 set ■Rinse Nozzle: 1 set ■Bake Unit: 3 sets (Max 200℃) ■Cooling Unit: 1 set ■Centering Unit: 1 set ■Device Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.