Semi-automatic double-sided simultaneous exposure device (Semi-auto double mask aligner)

This is a device that allows simultaneous exposure of the front and back surfaces of wafers using a belt conveyor method. It can be set to fast exposure mode or alignment exposure mode.

This product is a semi-automatic double-sided simultaneous exposure device. The removal and loading from the wafer carrier is done using a belt system. The mask and wafer come into contact and are exposed simultaneously. There are two exposure modes selectable via recipes: a fast exposure mode without alignment and an alignment exposure mode where the alignment of the wafer and mask is performed manually. Utilizing the features of the belt transport system, the fast exposure mode allows for high throughput processing. The alignment of the upper and lower masks, as well as the mask-wafer alignment, is done with the same I.F., ensuring that operations do not become complicated. Additionally, changing the mask is also easy. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Simultaneous double-sided exposure ■ Fast exposure mode, alignment exposure mode ■ Easy setup change, compatible with multiple substrate sizes ■ Space-saving & easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Belt transport system *For more details, please refer to the PDF document or feel free to contact us.

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