Easy setup, automatic parallel adjustment, complete non-contact gap management. A low-cost manual mask aligner without a transport system.
This product is a manual batch equal exposure mask alignment device. It is a device that sets the substrate on the exposure stage and performs exposure. The wafer is manually set onto the exposure stage. The tedious alignment of the photomask and wafer, as well as gap adjustments, are done automatically. Additionally, by incorporating a super-precision UVW drive stage and performing high-performance image processing, the alignment of the photomask and wafer is carried out accurately. It supports both soft and hard contact. With a lineup tailored to production volume, ranging from manual to fully automatic machines, we achieve low prices by handling everything from design to manufacturing and sales in-house. Custom orders for special substrates are also accepted. 【Features】 - Complete non-contact alignment and exposure of photomask and wafer - Equipped with auto-alignment function - Easy setup changes, compatible with multiple substrate sizes - Suitable for small-batch production, research, and development - Space-saving and easy maintenance - Achieves low price and compact design - Equipped with super-precision UVW stage - Custom orders for special substrates available *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■ Mask Size: □3" to □7" ■ Wafer Size: Φ2" to Φ6", square substrate □2" to 4" ■ Exposure Light Source: Ultra-high pressure mercury lamp (250W, 500W), UV-LED light source also compatible ■ Alignment Operation: Auto alignment ⇔ Manual alignment switchable ■ Transport Method: Wafer manually set to exposure stage ■ Parallel and Gap Adjustment: Automatic ■ Equipment Size: (Example) 1200×1050×2100 (main body) *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※5 to 6 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
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