Semi-automatic double-sided simultaneous exposure device (Semi-auto double mask aligner)
This is a device that allows simultaneous exposure of the front and back surfaces of wafers using a belt conveyor method. It can be set to fast exposure mode or alignment exposure mode.
This product is a semi-automatic double-sided simultaneous exposure device. The removal and loading from the wafer carrier is done using a belt system. The mask and wafer come into contact and are exposed simultaneously. There are two exposure modes selectable via recipes: a fast exposure mode without alignment and an alignment exposure mode where the alignment of the wafer and mask is performed manually. Utilizing the features of the belt transport system, the fast exposure mode allows for high throughput processing. The alignment of the upper and lower masks, as well as the mask-wafer alignment, is done with the same I.F., ensuring that operations do not become complicated. Additionally, changing the mask is also easy. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Simultaneous double-sided exposure ■ Fast exposure mode, alignment exposure mode ■ Easy setup change, compatible with multiple substrate sizes ■ Space-saving & easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Belt transport system *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■ Mask Size: □5" to □7" ■ Wafer Size: Φ4" to Φ6" ■ Cassette Stage: 2 sets each of loader and unloader ■ Centering Unit: 1 set with automatic alignment function ■ Exposure Light Source: Ultra-high pressure mercury lamp (250W, 500W); UV-LED light source also compatible ■ Equipment Size: (Example) 1800×1000×1900 (main body) ■ Transport Method: Belt conveyor system *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※5 to 6 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
