A mask aligner that achieves a high throughput of 190 WPH.
This is a fully automatic exposure device compatible with a 2-inch wafer size. By replacing the conventional multi-joint robots used in wafer transport with three self-developed transport robots, we have achieved a high throughput of 190 pieces (2-inch wafers) per hour. In particular, the newly developed alignment image processing employs auto-alignment that performs composite searches with arbitrary coordinate specification and intelligent θ search. Additionally, to ensure stable visibility, the microscope's halogen lighting incorporates a new mechanism that feeds back illumination attenuation through image processing. The operator simply sets the photomask and wafer and selects a pre-stored exposure recipe, allowing for automatic wafer transport, alignment with the photomask, and exposure, enabling stable exposure with precision that does not depend on the operator or experience level.
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basic information
Main Features 1. Equipped with a well-established 500W multi-light source. 2. Automatically performs substrate supply, alignment, exposure, and substrate discharge, achieving a class-leading processing capability of 190 wafers per hour (for 2-inch wafers). 3. The parallel alignment of the mask and wafer can be adjusted for each exposure using a correction function plate. 4. Adopts an image processing intelligent search function that sequentially searches 10 registered retry coordinates based on the recipe. 5. Equipped with a line alignment function for the first exposure. 6. The exposure method can be selected from soft contact, proximity, and hard contact (vacuum adhesion). 7. Easy changeover between 2-inch and 4-inch wafers. 8. The halogen lighting of the microscope is maintained at optimal brightness through image processing and supports low-contrast marks. 9. Displays error messages related to troubles on the operation panel.
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Applications/Examples of results
Electronics Field ●Microdevices - Semiconductors, various devices, sensors (photolithography processes for wafers, glass substrates, etc.) ●LED
Detailed information
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Main features of the product: It automatically performs substrate supply, alignment, exposure, and substrate discharge, while achieving a class-leading processing capacity of 190 wafers per hour (2-inch wafers) for wafer transport.
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Company information
For over half a century, we have continuously refined our technological and product capabilities. By integrating Ushio's unique proposal power with these strengths, we provide solutions that pave the way for the next generation to society and the market. In the business domain of light and industry, where further evolution is anticipated, we will maximize all our capabilities to contribute to the development of our customers and society.
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