Automatic positioning press with cameras and robots! Next-generation precision is now achievable!
【Product Description】 We have developed the world's first fully automatic press machine capable of alignment positioning using a six-axis multi-joint robot and CCD camera image processing. This allows for camera image positioning and punching processing with molds that have never been possible before. The machine processes sheet films automatically without the need for guide holes. The following are examples of its applications: FPC, COF substrates, various optical sheets (diffusion, reflection, polarization), special cards, LCD sheets, antenna sheets, lens sheets, IC cards, RFID tags, foil packages, deep-drawn foil cases, back sheets for solar cells, LED substrates, aluminum substrates, metal substrates, substrates for power semiconductors, heat sinks, heat dissipation sheets, and more.
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basic information
Established ultra-high precision positioning press processing method with ±1 micron accuracy. We are confident in our press processing that combines punching of battery components and transportation IC cards, where defective products cannot be tolerated, along with 100% inspection of processed products. In the mass production of copper heat dissipation substrates, which require strict quality and management capabilities, we have newly established a mass production method using molds made of diamond. Additionally, we developed a "sheet film fully automatic image positioning mold punching device" utilizing robots and camera image processing, becoming a certified factory for substrate processing in the transportation IC card field, which demands rigorous 4M management.
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FPC, COF substrates, various optical sheets (diffusion, reflection, polarization), special cards, liquid crystal sheets, antenna sheets, lens sheets, IC cards, RFID tags, foil packages, deep-drawn foil cases, back sheets for solar cells, LED substrates, aluminum substrates, metal substrates, substrates for power semiconductors, heat sinks, heat dissipation sheets, and more.
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Company information
In mold technology, we established a mass production method for copper heat dissipation substrates for power semiconductors in 2012. Products made of laminated copper and heat dissipation resin are not allowed to have any burrs on the cross-section, requiring strict processing cross-section quality and management capabilities. Therefore, we successfully developed and introduced molds using sintered diamond, making our manufacturing technology the key to product realization. Additionally, we have consolidated daily process management, such as micro-observation records of cross-sectional shapes, a quality assurance system that allows for full inspection by inspectors and automatic visual inspection machines, and a production management system that directly supplies to end users, proudly positioning ourselves as a "trusted processing partner."