Semi-Automatic Prober AP200/AP300

Semi-automatic prober compatible with microcurrent measurement and high-power measurement! It supports wafer sizes up to 8 and 12 inches, respectively.

-60℃ to +350℃ temperature characteristic evaluation, microcurrent measurement Compatible with power device measurements over 20kV and 200A ◎ A compact shield mechanism that can replace dry air prevents condensation even at negative temperatures. ◎ The compact shielding effect enables stable microcurrent measurements. ◎ The control software is user-friendly and excels in operability for operators. ◎ It can be equipped with automatic wafer alignment and automatic individual chip alignment utilizing image recognition. ◎ The control software is designed with icons arranged in process order to prevent operators from getting lost during operation, enhancing usability. ◎ It has a wafer alignment function that allows for angle adjustment and fine-tuning of XY positions using a model. ◎ After registering the die origin position, it features automatic detection of characteristic patterns through image processing, registering them as reference models. ◎ It is also possible to automatically align registered individual chips placed in a registered tray using image recognition. (Optional) ◎ It can be equipped with auto XYZ to accommodate wafer expansion, etc. (Optional)

Other inspection equipment and devices