Free abrasive processing that finishes workpieces to a flatter surface! We accommodate a wide range from small spot processing to mass production.
At Shinco Manufacturing Co., Ltd., we offer "lapping processing." Lapping processing involves performing sliding motion while containing free abrasive particles (grinding agents), which polishes the workpiece by making minute cuts, resulting in a flatter finish on the workpiece through free abrasive processing. We have a range of double-sided machines from large 18B models to small 5B models, and for single-sided machines, we offer various sizes from large 48-inch models to small 15-inch models, allowing us to accommodate a wide range of needs from small spot processing to mass production. We also handle various materials, including ceramics, metals, glass, and single crystals, so if you have any issues with lapping processing, please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.*
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Our main business focuses on precision processing of various hard materials, specializing in "grinding and cutting," including ceramics, crystalline materials, glass, metals, and resins. In recent years, we have particularly concentrated on ultra-precision cutting and polishing of various ceramics required for electronic components, as well as the power semiconductor field represented by SiC single crystals. In cutting technology, we can perform multi-wire cutting using a fixed abrasive method with diamond wire, and in polishing technology, we can achieve ultra-mirror polishing at the nano level. Additionally, in September 2023, we became Neos Group through M&A, establishing a consistent production system within the group that incorporates Neos's expertise in ultra-precision cleaning technology. If you have any issues with cutting, polishing, or cleaning processes, please feel free to contact Shinko Seisakusho!