■ It is possible to process ABF material blind holes with a high taper ratio and uniform hole bottom quality. ■ The minimum hole diameter is φ10um, allowing for control of processing quality.
2. Direct Processing of ABF Material Resin ■No.2-1: Example of blind hole processing with a diameter of φ10um to φ30um (t10um) ■No.2-2: Example of blind hole processing with a diameter of φ20um to φ40um (t25um) ■No.2-3: Example of square hole processing 20x20um, 30x30um, 40x40um, and 60x20um (t25um) ■No.2-4: Example of blind hole processing with a diameter of φ20um to φ50um, and an example of quality control for the bottom of φ50um blind holes (t23um)
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[Usage/Examples of Achievements] ■ For inquiries regarding contract processing requests or specification details, please contact us through the inquiry section on this page.
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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.