We are challenging the processing of new substrate materials compatible with high frequency, 5G, and automotive applications, with the cooperation of substrate material manufacturers and substrate manufacturing companies.
1. High-frequency and 5G compatible substrate processing ■No.1-1: Example of φ100um blind hole and through hole processing on fluororesin substrate (Rogers RO3003) ■No.1-2: Example of φ100um blind hole and through hole processing, as well as router processing on liquid crystal polymer substrate (Panasonic FELIOS LCP) ■No.1-3: Example of φ20um to φ50um blind hole processing on liquid crystal polymer substrate ■No.1-4: Example of φ150um blind hole processing on Panasonic R5515, MEGTRON6, and MEGTRON7 substrates
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【Contract Processing Request】【Specification Inquiry】 ■For contract processing requests and specification details, please contact us through the inquiry section on this page.
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【Usage/Examples of Achievements】 ■For inquiries regarding contract processing requests or specification details, please contact us through the inquiry section on this page.
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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.